The Evolution of Packaging: Beyond Protection
Microelectronic packaging has evolved from a simple protective function to a critical enabler of performance, reliability, and integration. In the demanding environment of space, the right packaging solution is essential for mission success. ALTER engineers are at the forefront of this evolution, leveraging deep technical knowledge to deliver advanced packaging solutions that meet the unique challenges of the space sector.
An example of this knowledge was the course provided by our engineer Nieves García during the last Electronics Manufacturing & Packaging Symposium (EMPS 2025) held in ESTEC las 6-9 October 2025, with great interest from participants and questions from the audience
From Classic to Advanced: The Packaging Revolution
The journey from traditional Dual In-line Packages (DIP) to state-of-the-art 3D Integrated Circuits (3D IC) reflects the relentless drive for miniaturization, higher performance, and greater integration. ALTER’s expertise spans the entire spectrum—from classic assembly techniques like wire bonding and die attach to cutting-edge approaches such as flip-chip, Fan-Out/In Wafer Level Packaging (FOWLP), and chiplet-based architectures.
But package market trend is moving at speed light
While classical approach is based on die connection (wire bonding), die attach (adhesive or solder), standard substrate, cavity sealing and external connections through lead, balls or pins, the optimisation of process and need for SWaP (Size, Weight, and Power) Optimization is leading to New die connections (flip chip, fan-out/in, WLP), underfill, Interposers/RDL/TSV, multiple cheap integrations, 2D, 2.5D, 3D and SiP.
During EMPS event, a detailed review of the current state of- the-art for advanced packaging structures and assembly techniques were provided to the audience.
Beyond packaging techniques, inspection and reliability through testing
The key degradation modes in packaging were discussed and presented to participants, with emphasis and examples from ALTER laboratories:
- Thermo-mechanical stressà CTE mismatch, warpage, cracking
- Moisture ingressà, corrosion, delamination
- Electromigration & Stress migration in interconnects
- Void formation in solder joints and adhesives
Dielectric breakdown due to high fields or contamination
A mix of classical techniques like X-ray, CT Scanning, CSAM, Thermal imaging and electrical test are extended with advanced techniques like SEM, FIB, 3D X-Ray and XRF.
Some examples of degradation mechanisms and the techniques to detect them were shown, among others:
The following table provides a summary of the main degradation mechanisms and the applicable Inspection techniques:
ALTER technology, your partner for packaging activities
By combining the manufacturing expertise of ALTER UK with the advanced testing capabilities of ALTER Spain, ALTER offers a comprehensive one-stop solution for your packaging needs in space applications, from low to medium volumes.
We understand the unique constraints and requirements of packaging for space environments, and we help you address them effectively by integrating ALTER’s capabilities into your design process.
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