Wire Bonding

Wire bonding is the main method of making interconnections between a semiconductor die and a package or substrate. 

We work closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules, where possible, are adhered to. This co-design activity is crucial in developing a high-yield, fully automated and optimized wire bond process. By controlling and optimizing key processes and material parameters such as ultrasonic energies and wire specification, robust and reliable processes can be developed.  Our company also offers wire pull and ball shear test data to enable the qualification of the wire bond process. 

• Au ball bonding 17 to 50um 
• Al wedge bonding 17 to 50um 
• Heavy Gauge Al wedge bonding up to 500um 
• Au Ribbon  
• Au Stud-bumping 

ALTER’s expertise and capability in this assembly processes service will reduce risk and reduce time to market for your requirements as well as providing a cost-effective manufacturing option.

We offer Gold (Au) ball wire bonding utilizing advanced automated equipment. Wire bond diameters from 17um to 50um can be handled with a capability for fine pitch wire bonding down to 50um. 

As an expert company we also utilise a range of advanced techniques including reverse bonding for low loop profiles, die to die bonding and deep access wire bonding.  ALTER’s Gold (Au) ball wire bonding services are applied to a wide range of package types including QFN, ceramic packages, open-cavity plastic packages and PCB’s. 

Aluminium (Al) or Gold (Au) Wedge Bonding 17 µm to 75 µm diameter wire. 

Ribbon Bonding Au up to 50µm X 250µm ribbon.  The larger surface area of the ribbon makes it an ideal interconnection option for high-speed RF applications and high-power devices.