Semiconductor Packaging and Assembly

Packaging and Assembly for optoelectronics and microelectronic devices

ALTER is an Outsourced Semiconductor Assembly and Test (OSAT) company providing outsourced assembly/packaging and testing of microelectronic semiconductor devices such as ICs, ASICs, MEMS, sensors, laser diodes, LEDs, VCSELs and discretes. 

ALTER offers a one-stop shop offering a complete back-end service for IC manufacturers, from package design, assembly and packaging, testing and qualification.  This ensures all our clients’ needs and requirements can be met and minimizes the expensive capital equipment and personnel requirements of our clients. 

Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimization, product qualification, failure analysis and volume manufacturing. 

We offer you services in the following areas:

Fast Turn IC Packaging

Fast Turn IC prototype packaging is a service offered by ALTER that provides a rapid turnaround of prototype IC devices; if required, this can also be on a one-day basis.

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Plastic encapsulation

ALTER has invested in the equipment and process development to make this capability accessible in Europe, enabling low-cost and high-throughput assembly.

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QFN Package

The QFN (Quad Flat No Lead) package is designed for near-chip scale packaging, offering excellent electrical and thermal performance via an exposed solderable pad.

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Chip on Board (COB)

ALTER can attach a die face-down onto a PCB using flip-chip technology, this can either be done using solder balls pre-applied at a wafer level or using our in-house gold stud bumping process.

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Package design and modelling

ALTER utilizes Package Design and Modelling techniques to ensure that any designs are compatible with a low-cost, high-yield assembly process.

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Hermetic Packaging

ALTER offers hermetic die packaging into robust ceramic and metal packages for high-reliability and harsh environment applications such as space, aerospace and defence.

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We focus our work in the following areas

icon semiconductor

Assembly Processes

Unleashing efficiency for cost savings and swift market entry

icon chip

Package Design

Providing contract package design and assembly service

icon photonic

Photonics Packaging

Aligning light, managing heat, ensuring excellence

Datasheets

Current focus topics

We support you in all packaging and assembly issues

Send email to info@uk.altertechnology.com

info@uk.altertechnology.com

Phone call

+44(0)1506 403 550

Contact form

Contact Form

Send email to info@uk.altertechnology.com

info@uk.altertechnology.com

Phone call

+44(0)1506 403 550

Contact form

Contact Form