System in package

System in package incorporates several integrated circuits in a single package in a way that maintains the demanding form factor requirements. 

The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products. 

ALTER offers customers support in prototype/process development for their System in Package (SiP) requirements and volume manufacturing capability. By prototyping on the volume manufacturing tool set, ALTER can offer a risk-free transition to manufacturing with a fully optimised and high-yield process. A summary of our capabilities can be seen below:

1. Dicing of thin wafers (>100µm).
2. Handling of thin die (e.g 50u thick, 15mm x 15mm on a side).
3. Die handling to 250 µm on a side.
4. Die overhang and bonding to unsupported die edges. 

1. Controlled bond line thickness to reduce height. 
2. Control of post-reflow ball height.