Fast Turn IC prototype packaging


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The Fast Turn IC prototype packaging service provides a rapid-turn around of prototype IC devices, if required this can also be on a one day basis.

Prototype assembly of ICs into standard packages accelerates evaluation of new designs and offers low cost for small projects.

ALTER provides IC packaging solutions to our rapidly expanding customer base, which includes several large multi-national corporations and many fabless IC design houses. We have a wide variety of packaging capabilities used to provide fast-turn-around IC packaging.

Understanding the critical requirements for IC manufacturers in providing rapid turn-around packaging of new chip designs which are typically required for customer sampling and engineering evaluation activities enables ALTER to provide these companies with a quick turn-around essential to maintain a competitive lead, be first to market and reduce costly product development cycles.

Benefits of ALTER UK IC prototype packaging

ALTER UK is set-up to be flexible and responsive to the prototype needs of our clients. We can easily deal with small batch sizes, on-the-fly changes to packaging requirements and deal with unique or non-standard die/wire-bond layouts. Our machine set-up flexibility means that we can deal with a variety of packaging requirements without costly set-up charges for jigs, fixtures and machine programming. In addition, our lower overheads compared to larger assembly houses provide a cost-effective solution. 

ALTER UK understands that many IC companies require additional support and advice, and often don’t have dedicated packaging resources. ALTER UK’s experienced engineering and production teams can offer assistance, technical support and advice in all aspects of IC packaging, and our clients can leverage our 200-man years of experience in IC device packaging.   

The result of ALTER UK’s service is that our clients can effectively improve the efficiency of their product development cycles and ensure success in getting first-to-market products. 

IC prototype packaging capabilities

Prototype ICs are typically packaged using standard off-the-shelf package types such as cavity QFN, ceramic quad flat pack, pin grid array, etc. Use of standard packages, assembly design rules and price lists accelerates the time to quote, order and fulfilment of the process.

ALTER’s Fast Turn IC prototype packaging services cater to a diverse range of targets, including wafer foundries, ASIC designers, fabless IC manufacturers, multi-project wafer aggregators, supply chain management, universities and start-ups.

Access to Factsheets the Fast Turn Design Rules

This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.


Fast Turn Design Rules Factsheet

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