Package Design and Modelling

ALTER utilizes Package Design and Modelling techniques to ensure that any designs are compatible with a low-cost, high-yield assembly process. 

Our mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, and high-power laser coupling. 

During this process, consideration is given to the selection of suitable component materials, die die-attach materials, based upon the intended in-field use and performance requirements. 

Understanding the required environmental operating conditions and thermal, optical, mechanical and electrical requirements is the key to any successful package design activity. 

This in turn, drives mechanical piece-part tolerances, whether these are ±10um or ±1um. Mechanical drawing generation includes the dimensional and surface quality definitions and tolerances required to achieve the module’s performance and reliability. 

It is crucial that the package design adheres to the rules but also the design rules for the assembly process, such as wire bond design rules, plating specifications to enable soldering of components and appropriate pattern recognition points to enable automated accurate pick and place of components. 

Thermo-mechanical finite element modelling is used in conjunction with our design activities to assess temperature gradients within the device and the package and to understand the package mechanical stability. 

This activity drives the definition and design of the package, layout of components within the package, material selections, external heat-sinking options, and appropriate joining materials to ensure expansion matching of materials. If the heat is not effectively dissipated from the device then the performance can be severely impacted. 

ALTER works with industry leading package suppliers to ensure designs meet their design rules, and handle procurement of package tooling and materials ready for assembly. 

Download Datasheets for advanced packaging solutions

Explore our expertise through ALTER's Packaging and Assembly datasheets. Click now to explore cutting-edge solutions, from fast IC prototype packaging to advanced hermetic sealing. Discover our capabilities in ASIC packaging, MEMS, laser diode modules, and more. 


Access to Datasheets        25 KB | PDF

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