Advanced packaging integrates multiple semiconductor dies or chiplets within a single package. It enables device developers to combine different functions and semiconductor technologies, shorten critical interconnections and increase functionality without relying on one large monolithic die.

ALTER provides cost-effective Quad Flat No-lead (QFN) plastic packaging from its Scotland facility for low- to medium-volume requirements and early-stage products preparing for higher-volume manufacture. Its advanced packaging development work focuses on scalable assembly solutions for fabless companies, design houses, semiconductor manufacturers, wafer fabs and foundries.

As semiconductor devices become more complex, incorporating every function into a single die may increase development cost, constrain the choice of process technology and limit system flexibility. Advanced packaging provides an alternative by distributing functions across smaller dies and integrating them within the same package.

This approach can address five connected requirements:

The technical and commercial benefit depends on the device architecture, die technologies, interfaces, packaging constraints and expected production volume. These factors must therefore be assessed together at the beginning of the project.

Different semiconductor materials provide different performance characteristics. Silicon remains widely used for logic and memory, while compound semiconductors such as gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) may be selected for radio-frequency, high-voltage, high-current or other specialised functions.

Advanced packaging makes it possible to consider these technologies as parts of one system rather than forcing every function onto the same die. Dies or chiplets can be connected through short, purpose-designed interconnections within the package, subject to compatibility between their mechanical, electrical and material requirements.

This approach is relevant to multifunction devices, specialised sensors and other products in which the required capabilities cannot be delivered efficiently by a single semiconductor technology. ALTER’s work in image sensor development and evaluation provides a related route for projects involving imaging technologies.

ALTER’s current packaging scope includes cost-effective QFN plastic packaging at its Scotland facility. The service is intended for projects that may not be well served by assembly providers focused primarily on very high-volume consumer, mobile or automotive production.

It can support:

• Low- and medium-volume semiconductor requirements.
• New devices requiring initial packaged units.
• Bespoke developments that need a defined route beyond prototyping.
• Early-stage products being prepared for higher-volume manufacture.
• Projects involving chip designers, wafer fabs, foundries and end users.

QFN packaging provides a practical platform for compact semiconductor devices, but the suitability of the format must be reviewed against die dimensions, electrical interfaces, thermal requirements, assembly constraints and the intended application.

ALTER has also applied QFN packaging to test vehicles developed for the SRPROTEC radiation-shielding project, demonstrating its use within a defined semiconductor technology-development programme.

Advanced packaging may be considered when a semiconductor project requires several functional dies to operate as one device, when individual functions benefit from different process technologies or when package-level integration can reduce the size and complexity of the final system.

It is also relevant when a company needs packaged initial units but cannot access an appropriate low- or medium-volume manufacturing route. In this situation, packaging decisions must account not only for the first devices but also for subsequent characterisation, qualification and potential production scaling.

Typical starting points include an existing die design, fabricated wafers, separated dies, an initial package concept or a requirement to integrate multiple technologies. The correct starting point depends on how mature the product is and which design, assembly or validation activities have already been completed.

An initial technical review should define the device, the intended package and the conditions under which it must operate. Useful project inputs include:

• Die technology, dimensions and available design information.
• Number of dies and the function of each device.
• Required electrical and physical interfaces.
• Target package dimensions and system constraints.
• Intended application and operating conditions.
• Initial quantity and expected production-volume progression.
• Characterisation, inspection and qualification requirements.
• Available wafers, dies, prototypes or reference devices.

This information allows ALTER to assess whether the requested package architecture is compatible with the available packaging route and to identify any additional development or validation activities.

Each project begins with a review of the device architecture, die technologies, interfaces, package objectives and expected volumes. The resulting scope defines the appropriate packaging route and the information, materials and devices required from the customer.

After assembly, packaged devices may require electrical verification or characterisation. ALTER’s Electrical Testing capabilities can support the evaluation of new products, initial units and repeatable test processes.

Physical assessment may also be needed to examine construction, materials and internal interfaces. Constructional Analysis can be used to investigate package structure and evaluate new technologies, first units or assembly processes.

Where the project must demonstrate reliability under defined application conditions, packaging activities can be connected with a documented Qualification Plan. The appropriate test sequence depends on the device, package, application and applicable requirements.

The exact outputs are agreed during project definition. Depending on the confirmed scope, a project may provide packaged devices or initial units, an agreed packaging approach and documentation associated with the assembly, inspection, characterisation or qualification activities included in the programme.

Test reports, analysis results and qualification documentation are provided only when the corresponding activities form part of the agreed scope. Production volumes, schedules, package configurations and deliverables are confirmed after technical review rather than assumed from the initial enquiry.

Advanced packaging is not a single standard process that can be applied to every combination of dies and materials. Compatibility depends on die geometry, semiconductor technology, interfaces, package design, assembly requirements, expected volumes and downstream testing.

This service specifically covers QFN plastic packaging and ALTER’s advanced packaging development activities. Other package formats, interconnection methods, material combinations or production requirements must be assessed and confirmed for each project.

Early engagement is recommended because packaging decisions can affect device layout, electrical access, thermal behaviour, test strategy, qualification planning and the route towards production.

Use the contact form below to describe your device, available wafers or dies, package objectives, expected volumes and validation requirements. ALTER will review the information to determine the appropriate next step and whether the proposed packaging route can be supported.