ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
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The latest in Packaging & Assembly
Trends in Microelectronics Packaging and Testing
Microelectronics packaging has moved beyond protection to become a key enabler of performance and reliability. ALTER leads this evolution with advanced packaging and testing solutions for space missions, combining deep expertise from its UK and Spain teams.
Creating a Magneto-Optical Trap (MOT) Using the FLAME Frequency-Stabilised Laser Module
Learn how to create a Magneto-Optical Trap (MOT) using the FLAME frequency-stabilised laser module for advanced atomic physics experiments
ALTER receives space agency process capability approval certification
ALTER’s certification strengthens its role as a trusted space agency supplier, meeting ESA’s stringent quality standards.
Trends in Microelectronics Packaging and Testing
Microelectronics packaging has moved beyond protection to become a key enabler of performance and reliability. ALTER leads this evolution with advanced packaging and testing solutions for space missions, combining deep expertise from its UK and Spain teams.
Creating a Magneto-Optical Trap (MOT) Using the FLAME Frequency-Stabilised Laser Module
Learn how to create a Magneto-Optical Trap (MOT) using the FLAME frequency-stabilised laser module for advanced atomic physics experiments
ALTER receives space agency process capability approval certification
ALTER’s certification strengthens its role as a trusted space agency supplier, meeting ESA’s stringent quality standards.
ALTER UK achieves ISO 45001 and ISO 14001, strengthening commitment to health, safety and sustainability
ISO 14001 certification highlights ALTER’s commitment to minimizing environmental impact through sustainable practices.
Access to Datasheets
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Downloads 25 KB | PDF
ALTER UK achieves ISO 45001 and ISO 14001, strengthening commitment to health, safety and sustainability
ISO 14001 certification highlights ALTER’s commitment to minimizing environmental impact through sustainable practices.
ALTER launches Heavy Gauge Wire Bonding capability
ALTER introduces heavy gauge wire bonding capability, supporting high-power semiconductor applications like EVs and renewable energy systems.
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
Laser diode modules
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Trends in Microelectronics Packaging and Testing
Microelectronics packaging has moved beyond protection to become a key enabler of performance and reliability. ALTER leads this evolution with advanced packaging and testing solutions for space missions, combining deep expertise from its UK and Spain teams.
Creating a Magneto-Optical Trap (MOT) Using the FLAME Frequency-Stabilised Laser Module
Learn how to create a Magneto-Optical Trap (MOT) using the FLAME frequency-stabilised laser module for advanced atomic physics experiments
ALTER receives space agency process capability approval certification
ALTER’s certification strengthens its role as a trusted space agency supplier, meeting ESA’s stringent quality standards.
All Blog Posts
The latest in Packaging & Assembly
ALTER UK achieves ISO 45001 and ISO 14001, strengthening commitment to health, safety and sustainability
ISO 14001 certification highlights ALTER’s commitment to minimizing environmental impact through sustainable practices.
ALTER launches Heavy Gauge Wire Bonding capability
ALTER introduces heavy gauge wire bonding capability, supporting high-power semiconductor applications like EVs and renewable energy systems.
Trends in Microelectronics Packaging and Testing
Microelectronics packaging has moved beyond protection to become a key enabler of performance and reliability. ALTER leads this evolution with advanced packaging and testing solutions for space missions, combining deep expertise from its UK and Spain teams.
Creating a Magneto-Optical Trap (MOT) Using the FLAME Frequency-Stabilised Laser Module
Learn how to create a Magneto-Optical Trap (MOT) using the FLAME frequency-stabilised laser module for advanced atomic physics experiments
ALTER receives space agency process capability approval certification
ALTER’s certification strengthens its role as a trusted space agency supplier, meeting ESA’s stringent quality standards.
Access to Datasheet
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Download 25 KB | PDF
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
Laser diode modules
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.