ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
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ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Downloads 25 KB | PDF
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
Plastic encapsulation molds semiconductor chips directly with epoxy, avoiding air cavities. A streamlined process for chip assembly in packaging.
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Download 25 KB | PDF
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
Plastic encapsulation molds semiconductor chips directly with epoxy, avoiding air cavities. A streamlined process for chip assembly in packaging.
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.