ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
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The latest in Packaging & Assembly
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Access to Datasheets
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Downloads 25 KB | PDF
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
Laser diode modules
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC Packaging
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Advanced Packaging
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
Plastic encapsulation
Plastic encapsulation molds semiconductor chips directly with epoxy, avoiding air cavities. A streamlined process for chip assembly in packaging.
Optical Alignment
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die Bonding
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
Wafer Sawing
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
Photonic Integrated Circuit (PIC) Packaging
ALTER excels in assembling and packaging Photonic Integrated Circuit (PIC) devices, including Silicon and InP PIC. Expert PIC packaging for optimal performance.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
All Blog Posts
The latest in Packaging & Assembly
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Access to Datasheet
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Download 25 KB | PDF
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
Laser diode modules
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC Packaging
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Advanced Packaging
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
Plastic encapsulation
Plastic encapsulation molds semiconductor chips directly with epoxy, avoiding air cavities. A streamlined process for chip assembly in packaging.
Optical Alignment
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die Bonding
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
Wafer Sawing
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
Photonic Integrated Circuit (PIC) Packaging
ALTER excels in assembling and packaging Photonic Integrated Circuit (PIC) devices, including Silicon and InP PIC. Expert PIC packaging for optimal performance.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.