About ALTER UK

ALTER is an Outsourced Semiconductor Assembly and Test (OSAT) company providing outsourced assembly/packaging and testing of microelectronic semiconductor devices such as ICs, ASICs, MEMS, image sensors, laser diodes, LEDs, VCSELs and discretes. 

ALTER offers a one-stop shop offering a complete back-end service for IC manufacturers, from package design, assembly and packaging, testing and qualification.  This ensures all our clients’ needs and requirements can be met and minimizes the expensive capital equipment and personnel requirements of our clients. 

Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimization, product qualification, failure analysis and volume manufacturing. 

Our Fast Turn IC packaging service helps customers with rapid evaluation of new chip designs, reducing cost and accelerating time to market before ramping to volume production.  A typical customer may have 10’s of chips from a multi-project wafer which can be packaged within 5 days.  The use of standard packages and design rules ensures rapid start-up and short lead-times.

For volume run-rate production, our state of the art, automated assembly equipment can support millions of dies per year and now includes a plastic encapsulation capability enabling low cost QFN packaging without the need to engage with high-volume assembly houses who usually require commitments of several millions of devices per year.

For devices in high-reliability applications such as space and aerospace, or sensor devices such as MEMS, ALTER offers fully hermetic packaging in ceramic or metal packages which can also include windows for optical sensors or lasers.

Through our group of companies in Spain, France and Germany we can offer end to end turnkey backend semiconductor manufacturing from wafer testing, dicing and singulation up to assembled and tested product.

For special requirements not catered by standard packages, ALTER offers a package design service including the thermal, mechanical and optical to select the optimal materials and processing for your device.

Our process and design IP and know-how enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with any new product development.

Packaging takes place in our ISO class 7 clean room, supported by EN9100 and ISO9001 quality management system.

As a leader in Semiconductor Packaging and Assembly, we have a rich history of delivering cutting-edge solutions to clients across various industries. We pride ourselves not only on our cutting-edge technology but also on our global presence.

Explore our locations worldwide to get a glimpse into our innovative facilities and the talented teams driving our success.

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