ALTER UK provides hermetic sealing of various ceramic and metal package configurations including:
- Ceramic packages, CQFP, CPGA, LCC, DIL
- TO-can packages
- Butterfly Laser packages.
- Parallel resistance welding for rectangular or square packages.
- Projection welding is used for TO-can devices.
- AuSn solder sealing
Prior to sealing parts, they are put through a Vacuum bake-out process to remove moisture and other residues from the component surfaces. Devices can be hermetically sealed in a wide variety of inert gas atmospheres including N2, Ar, O2, depending on the customers’ exact requirements.
Fine and Gross leak tests are carried out to MIL-STD-883. ALTER has achieved leak rates of <5E-9 for a fibre-coupled butterfly package. This offers the potential of reducing the length of lifetime tests in certain applications.
ALTER expertise and capability in encapsulation and hermetic sealing will reduce risk and reduce time to market as well as providing a cost-effective manufacturing option.
Download Datasheets for advanced packaging solutions
Explore our expertise through ALTER’s Packaging and Assembly datasheets. Click now to explore cutting-edge solutions, from fast IC prototype packaging to advanced hermetic sealing. Discover our capabilities in ASIC packaging, MEMS, laser diode modules, and more.
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