ALTER TECHNOLOGY UK, part of TUV NORD group, are pleased to announce the production release of 12” / 300mm wafer dicing within our European OSAT capability. This additional capability in the Scottish packaging facility is crucial to supporting the UK and European semiconductor industry.
300mm diameter wafers are set to be the workhorse of the semiconductor industry for the foreseeable future and is now the primary diameter used in new wafer fab installations worldwide. Around 160 wafer fabrication plants are now producing 300mm wafers, and with an average of 10 new installations per year, this number is set to reach 200 by 2026. 300mm installations now surpass the previous standard 200mm (8” wafers).
300mm wafers are ideal for large area die, such as processors and CMOS image sensors, but are now also being used to drive efficiency and lower cost for ASICs and power electronics devices such as transistors.
12” wafer dicing can be combined with ALTER’s automated assembly lines, including overmoulded plastic QFN production, hermetic packaging, or chip-on-board assembly, with customer chips being directly picked from diced wafers and bonded onto package leadframes or substrates.
ALTER can also offer thinning of wafers by using a backgrind process. Our team has experience mounting and dicing thin wafers down to 100um in thickness. In addition to handling very thin die our company can also dice substrates up to 1mm thick.
A wide variety of wafer and substrate materials can be processed, including Silicon, Multi-Project Wafers (MPW), GaAs, GaN, FR4, Glass, Ceramics and Laminates. Dicing blades of different sizes and materials are stocked and selected depending on the substrate material and thickness.
ALTER can accept customers’ wafers directly from the wafer foundry and provide a complete European OSAT (Outsourced Semiconductor Assembly & Test) service, including electronic wafer sort/probing, wafer dicing, packaging, final test, and qualification.
For enquires or more information contact Matt Booker, Commercial & Innovation Director, matt.booker@uk.altertechnology.com
About ALTER TECHNOLOGY TÜV NORD
ALTER UK are the leading provider of microelectronics and optoelectronics services in engineering, assembly, and test in space and harsh environment markets. Our company develops and offers complete turn-key solutions covering wafer testing, assembly, packaging, final test, and qualification. Our services also extend to equipment and systems testing and certification in fields like small satellites, drones, security, transport, nuclear.
About TÜV NORD GROUP
A“Making our world safer”. With over 14,000 employees, including more than 6,700 with a technical/scientific background, the TÜV NORD Group is one of the largest technical service providers in Germany. It also operates in over 70 countries in Europe, Asia, Africa, and the Americas. The Group owes its leading market position to its technical competence and a broad range of advisory, service, and testing services in the Mobility, Industrial Services, International, Natural Resources and Training and Human Resources fields.