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    • QFN package
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  • APPLICATIONS
    • Image sensor packaging
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  • PHOTONICS
    • Photonic Integrated Circuit (PIC)
    • Custom photonic packaging
    • Laser diode modules
  • ASSEMBLY PROCESSES
    • Wafer sawing
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logo alterno ALTER
  • IC PACKAGING
    • QFN package
    • Hermetic packaging
    • Advanced packaging
    • Fast Turn IC
  • APPLICATIONS
    • Image sensor packaging
    • Chip on Board (COB)
    • MEMS packaging
    • System in package
    • ASIC packaging
  • PHOTONICS
    • Photonic Integrated Circuit (PIC)
    • Custom photonic packaging
    • Laser diode modules
  • ASSEMBLY PROCESSES
    • Wafer sawing
    • Die bonding
    • Wire bonding
    • Flip chip
    • Optical alignment
    • Plastic encapsulation
    • Hermetic sealing
  • RESOURCES
    • Blog
    • Downloads
    • News
  • CONTACT US

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Contact us
Send email
Contact Form
Our Location
Address

5 Bain Square

EH54 7DQ Livingston, Scotland, UK

+44(0)1506 403 550

Services

Fast Turn IC prototype packaging

Package design and modelling
QFN package
Chip on Board (COB)
Hermetic packaging

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© TÜV NORD GROUP   Privacy Policy and Legal Notice| Copyright Notice |   Contact Clause

Contact us

Send email

Contact Form

Our Location

Address

5 Bain Square

EH54 7DQ Livingston, Scotland, UK 

+44(0)1506 403 550

Services

Fast Turn IC prototype packaging

QFN package

Package Design and Modelling

Chip on Board (COB)

Hermetic packaging

SOCIAL MEDIA

  • Follow
  • Follow

© TÜV NORD GROUP   Privacy Policy and Legal Notice  | Copyright Notice |   Contact Clause