Applications

ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.

ALTER excels in MEMS packaging, precision assembly of inertial sensors, accelerometers, microfluidic, and optical MEMS devices.

LED Chip-on-Board benefits and advantages: cost-effectiveness, custom arrays, enhanced efficiency, and reduced ownership costs.

Explore ALTER UK’s expertise in image sensor packaging assembly. Overcome unique challenges for correct function and device integrity.

ALTER UK offers customers support in both prototype/process development for RF Module Packaging as well as volume manufacturing capability.

Incorporates multiple integrated circuits into a single package, meeting demanding form factor requirements — System in Package.

ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.

ALTER excels in MEMS packaging, precision assembly of inertial sensors, accelerometers, microfluidic, and optical MEMS devices.

LED Chip-on-Board benefits and advantages: cost-effectiveness, custom arrays, enhanced efficiency, and reduced ownership costs.

Explore ALTER UK’s expertise in image sensor packaging assembly. Overcome unique challenges for correct function and device integrity.

ALTER UK offers customers support in both prototype/process development for RF Module Packaging as well as volume manufacturing capability.

Incorporates multiple integrated circuits into a single package, meeting demanding form factor requirements — System in Package.

ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.

ALTER excels in MEMS packaging, precision assembly of inertial sensors, accelerometers, microfluidic, and optical MEMS devices.

LED Chip-on-Board benefits and advantages: cost-effectiveness, custom arrays, enhanced efficiency, and reduced ownership costs.

Explore ALTER UK’s expertise in image sensor packaging assembly. Overcome unique challenges for correct function and device integrity.

ALTER UK offers customers support in both prototype/process development for RF Module Packaging as well as volume manufacturing capability.

Incorporates multiple integrated circuits into a single package, meeting demanding form factor requirements — System in Package.