System in package

  

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System in package incorporates several integrated circuits in a single package in a way that maintains the demanding form factor requirements. 

The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products. 

ALTER offers customers support in prototype/process development for their System in Package (SiP) requirements and volume manufacturing capability. By prototyping on the volume manufacturing tool set, ALTER can offer a risk-free transition to manufacturing with a fully optimised and high-yield process. A summary of our capabilities can be seen below:

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wire bonding

Thin wafer and die handling

  1. Dicing of thin wafers (>100µm).
  2. Handling of thin die (e.g 50u thick, 15mm x 15mm on a side).
  3. Die handling to 250 µm on a side.
  4. Die overhang and bonding to unsupported die edges. 

Stacked die capability

  1. Controlled bond line thickness to reduce height. 
  2. Control of post-reflow ball height.

Wire-bonding

  1. Low loop heights (less than 75µm with 20µm wire diameter).
  2. Reverse bonding (loop heights <50um. 
  3. Small diameter wire (17u min). 
  4. Longer wire bond lengths (~6mm with 25µm wire diameter) Overhang bonds. 
  5. Die to Die bonding. 
  6. Variety of wire bond thicknesses to control wire sway. 
  7. Stand-off stitch (wire to bump).

Multiple component assembly on a single substrate

  1. Placement and attachment of passive components (Saw filters, EMI shields, connectors, etc.) 
  2. Placement and attachment of MEM’s, Opto and Mechanical components with active microelectronic components. 
  3. Double-sided board assemblies.

Various die technologies (Si, GaAs, SiGe, SOI, MEM’s, InP, GaN)

ALTER UK’s expertise and capability in System in Package assembly will reduce risk and reduce time to market for your System in Package requirements as well as providing a cost-effective manufacturing option. 

Download datasheets for advanced packaging solutions

Explore our expertise through ALTER’s Packaging and Assembly datasheets. Click now to explore cutting-edge solutions, from fast IC prototype packaging to advanced hermetic sealing. Discover our capabilities in ASIC packaging, MEMS, laser diode modules, and more. 

 

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