LED Chip-On-Board

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LED Chip-on-Board benefits and advantages: cost-effectiveness, custom arrays, enhanced efficiency, and reduced ownership costs.

Why LED Chip-on-Board?

Cost-effective alternative to incandescent and fluorescent light sources

Increased life span and efficiency
System integration, no user-serviceable parts
The reduced total cost of ownership
Customised array size and shape
Application-specific wavelengths

Chip-on-board vs. surface-mounted LEDs:

Low-pitch / higher density arrays
Improved efficiency and heat dissipation
No over-moulding material boosts light output
Fewer interconnects reduce reliability risk

Why ALTER?

Value Proposition

Experienced LED CoB module provider
The flexible and customisable platform
Reduced time to market:
- Product-specific experience and processes
- Established material supply chain
Reduced technical risk
- Existing design and process knowledge
- Rapid prototyping on production tools
Reduced cost
- There is no capex requirement for the customer Volume manufacturing capacity
- >200K LED placements per month.

Concept to a product:

Substrate design & sourcing, ceramic, IMS, FR4.
Sourcing tested & binned LED dies
Optical and thermal modelling
Full range of volume assembly services
Functional test
Characterisation

Assembly Capabilities

Die Attach

Ag epoxy stamping or dispensing
Sintering epoxy materials
Soldering
Pick from film/frame, waffle or gel pack.
Flip-chip attach & Au stud bumping

Wire Bond

17 to 50um Au ball bonding
Plasma clean for improved adhesion
Encapsulation Options
Frame laser cutting and attach
Glass cover attach
Silicone encapsulation
Dome attach
Specialist processes for mixing and degassing

QC checks

Die shear and wire strength tests
Placement accuracy measurements

Important parameters for the washing step include wash time, wash rpm, DI water pressure, dry time, dry rpm, temperature and airflow rate. As a company, we have developed a number of optimized wafer saw and wash processes for various MEMS and Sensor devices in order to avoid damage to the sensitive membrane and optical surfaces.

ALTER can accept customer’s wafers directly from the wafer foundry, and provide a complete back-end service including electronic wafer sort/probing, thinning and dicing, packaging and final test.

ALTER expertise and capability in wafer sawing will reduce risk and reduce time to market for your wafer saw requirements as well as providing a cost-effective manufacturing option.

Download Datasheets for advanced packaging solutions

Explore our expertise through ALTER’s Packaging and Assembly datasheets. Click now to explore cutting-edge solutions, from fast IC prototype packaging to advanced hermetic sealing. Discover our capabilities in ASIC packaging, MEMS, laser diode modules, and more.