Factsheets

ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.

Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.

This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.

This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.

Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.

ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.

ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.

Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.

This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.

This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.

Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.

ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.

ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.

Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.

This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.

This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.

Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.

ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.