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The latest in Packaging & Assembly
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Hermetic sealing
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
Access to Datasheets
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Downloads 25 KB | PDF
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Flip Chip
Explore flip chip efficiency in semiconductor assembly. ALTER excels in precise, bond pad-down attachment for superior electrical connections.
System in package
Incorporates multiple integrated circuits into a single package, meeting demanding form factor requirements — System in Package.
Wire Bonding
Explore wire bonding in semiconductor packaging. ALTER ensures optimal processes through collaborative design, maximizing yield.
Miniaturised Narrow Linewidth Lasers
Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.
Miniaturised RGB laser module
ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.
Quantum photonic projects
ALTER’s Quantum Photonic Projects datasheet: QUEST, SLAM, Single Ion, and rAmpart applications. Download for advanced quantum insights.
Packaging and Assembly services
Explore ALTER’s comprehensive Packaging and Assembly Services brochure. Discover tailored solutions for optimal semiconductor performance.
Drummond: Single Mode Collimated Diode Laser
Optimize performance with ALTER’s Drummond datasheet. Tailored for single-mode chips, it delivers defined specs. Download now for prompt lead.
Auerbach: Fibre Coupled Laser Diode
Auerbach from ALTER accommodates single mode hip structures, from manufacturers over multiple wavelengths in high reliability configurations.
Somerville Standard PIC Packaging
ALTER’s Somerville Standard PIC Packaging datasheet. Optimal for early PIC trials, it’s hermetic, cost-effective, and crafted with advanced processes.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
All Blog Posts
The latest in Packaging & Assembly
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
Access to Datasheet
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Download 25 KB | PDF
Flip Chip
Explore flip chip efficiency in semiconductor assembly. ALTER excels in precise, bond pad-down attachment for superior electrical connections.
System in package
Incorporates multiple integrated circuits into a single package, meeting demanding form factor requirements — System in Package.
Wire Bonding
Explore wire bonding in semiconductor packaging. ALTER ensures optimal processes through collaborative design, maximizing yield.
Miniaturised Narrow Linewidth Lasers
Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.
Miniaturised RGB laser module
ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.
Quantum photonic projects
ALTER’s Quantum Photonic Projects datasheet: QUEST, SLAM, Single Ion, and rAmpart applications. Download for advanced quantum insights.
Packaging and Assembly services
Explore ALTER’s comprehensive Packaging and Assembly Services brochure. Discover tailored solutions for optimal semiconductor performance.
Drummond: Single Mode Collimated Diode Laser
Optimize performance with ALTER’s Drummond datasheet. Tailored for single-mode chips, it delivers defined specs. Download now for prompt lead.
Auerbach: Fibre Coupled Laser Diode
Auerbach from ALTER accommodates single mode hip structures, from manufacturers over multiple wavelengths in high reliability configurations.
Somerville Standard PIC Packaging
ALTER’s Somerville Standard PIC Packaging datasheet. Optimal for early PIC trials, it’s hermetic, cost-effective, and crafted with advanced processes.
Dewar: TO can Devices
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
QPICPAC: Multi-fibre PIC Hermetic Packaging Module
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.