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ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
ALTER excels in assembling and packaging Photonic Integrated Circuit (PIC) devices, including Silicon and InP PIC. Expert PIC packaging for optimal performance.
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
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ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
The page you requested could not be found. Try refining your search, or use the navigation above to locate the post.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
ALTER ensures hermetic sealing excellence for diverse metal packages, including ceramic, TO-can, and butterfly laser configurations.
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ALTER’s Laser Diode Modules: Customizable solutions, diverse configurations, and in-house assembly/testing for precision in Photonics applications.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Download 25 KB | PDF
The page you requested could not be found. Try refining your search, or use the navigation above to locate the post.
ASIC packaging excellence from ALTER: Fast prototype, QFN ramp-up, and volume production. Rapid validation for efficient ASIC design testing.
Optimize semiconductor performance with Advanced Packaging. Utilize chiplets and heterogeneous integration for enhanced functionality.