ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
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ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.
ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.
ALTER’s Quantum Photonic Projects datasheet: QUEST, SLAM, Single Ion, and rAmpart applications. Download for advanced quantum insights.
Explore ALTER’s comprehensive Packaging and Assembly Services brochure. Discover tailored solutions for optimal semiconductor performance.
Optimize performance with ALTER’s Drummond datasheet. Tailored for single-mode chips, it delivers defined specs. Download now for prompt lead.
Auerbach from ALTER accommodates single mode hip structures, from manufacturers over multiple wavelengths in high reliability configurations.
ALTER’s Somerville Standard PIC Packaging datasheet. Optimal for early PIC trials, it’s hermetic, cost-effective, and crafted with advanced processes.
Access ALTER’s FLAME-780 datasheet: a compact, frequency-stabilized laser module with advanced tech for precise atomic reference locking. Download now.
Explore ALTER’s REMOTE datasheet: Ideal for quantum tech and spectroscopy, crafted with advanced techniques for high reliability. Download now!
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.
ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.
ALTER’s Quantum Photonic Projects datasheet: QUEST, SLAM, Single Ion, and rAmpart applications. Download for advanced quantum insights.
Explore ALTER’s comprehensive Packaging and Assembly Services brochure. Discover tailored solutions for optimal semiconductor performance.
Optimize performance with ALTER’s Drummond datasheet. Tailored for single-mode chips, it delivers defined specs. Download now for prompt lead.
Auerbach from ALTER accommodates single mode hip structures, from manufacturers over multiple wavelengths in high reliability configurations.
ALTER’s Somerville Standard PIC Packaging datasheet. Optimal for early PIC trials, it’s hermetic, cost-effective, and crafted with advanced processes.
Access ALTER’s FLAME-780 datasheet: a compact, frequency-stabilized laser module with advanced tech for precise atomic reference locking. Download now.
Explore ALTER’s REMOTE datasheet: Ideal for quantum tech and spectroscopy, crafted with advanced techniques for high reliability. Download now!
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
The Dewar from ALTER can accommodate various single mode chip structures from numerous chip manufacturers over multiple wavelenghts.
The QPICPAC Multi-fibre PIC Module: a standardized, hermetic, cost-effective solution with up to 16 fibers for PIC trial, system testing, and production volumes.
Access ALTER’s Miniaturized Narrow Linewidth Lasers datasheet: FLAME, frequency-stabilized module, and REMOTE, butterfly-packaged ECDL.
ALTER’s Miniaturized RGB Laser Module datasheet: Explore integrated optics, thermal design, and collimated light. Download for precision insights.
ALTER’s Quantum Photonic Projects datasheet: QUEST, SLAM, Single Ion, and rAmpart applications. Download for advanced quantum insights.
Explore ALTER’s comprehensive Packaging and Assembly Services brochure. Discover tailored solutions for optimal semiconductor performance.
Optimize performance with ALTER’s Drummond datasheet. Tailored for single-mode chips, it delivers defined specs. Download now for prompt lead.
Auerbach from ALTER accommodates single mode hip structures, from manufacturers over multiple wavelengths in high reliability configurations.
ALTER’s Somerville Standard PIC Packaging datasheet. Optimal for early PIC trials, it’s hermetic, cost-effective, and crafted with advanced processes.
Access ALTER’s FLAME-780 datasheet: a compact, frequency-stabilized laser module with advanced tech for precise atomic reference locking. Download now.
Explore ALTER’s REMOTE datasheet: Ideal for quantum tech and spectroscopy, crafted with advanced techniques for high reliability. Download now!