ALTER excels in assembling and packaging Photonic Integrated Circuit (PIC) devices, including Silicon and InP PIC. Expert PIC packaging for optimal performance.
Photonic Integrated Circuit (PIC) Packaging
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The latest in Packaging & Assembly
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Access to Datasheets
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Downloads 25 KB | PDF
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
Plastic encapsulation
Plastic encapsulation molds semiconductor chips directly with epoxy, avoiding air cavities. A streamlined process for chip assembly in packaging.
Optical Alignment
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die Bonding
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
Wafer Sawing
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
Photonic Integrated Circuit (PIC) Packaging
ALTER excels in assembling and packaging Photonic Integrated Circuit (PIC) devices, including Silicon and InP PIC. Expert PIC packaging for optimal performance.
MEMS Packaging
ALTER excels in MEMS packaging, precision assembly of inertial sensors, accelerometers, microfluidic, and optical MEMS devices.
LED Chip-On-Board
LED Chip-on-Board benefits and advantages: cost-effectiveness, custom arrays, enhanced efficiency, and reduced ownership costs.
Image sensor packaging
Explore ALTER UK’s expertise in image sensor packaging assembly. Overcome unique challenges for correct function and device integrity.
Custom Photonic Packaging
Precision in Optoelectronic or Photonic Packaging ensures accurate alignment and coupling of light into and out of devices.
RF Module Packaging
ALTER UK offers customers support in both prototype/process development for RF Module Packaging as well as volume manufacturing capability.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
All Blog Posts
The latest in Packaging & Assembly
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Plastic Encapsulated QFN: Design Rules
Explore ALTER’s plastic encapsulated QFN design rules for precise and reliable packaging solutions. Optimize your semiconductor performance.
ALTER add 12” wafer dicing capability to their UK packaging facility
12” / 300mm wafer dicing is now available at ALTER UK, enhancing support for the European semiconductor industry.
ALTER UK awarded contract for project Co-Packaged Optics Development
ALTER UK is developing a Co-Packaged Optical Transceiver for space, enhancing satellite communication with photonic and microelectronics integration.
Plastic Encapsulated QFN: Technical Data
ALTER UK offers low-cost plastic encapsulated QFN packaging for batch sizes from 100pcs to several 1000s, with total capacity for millions per year.
Access to Datasheet
Unlock the potential of our Packaging and Assembly expertise.
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Download 25 KB | PDF
Plastic encapsulation
Plastic encapsulation molds semiconductor chips directly with epoxy, avoiding air cavities. A streamlined process for chip assembly in packaging.
Optical Alignment
ALTER specializes in optical alignment, aligning optical fibers and components to various optoelectronic devices like diode lasers and Photonics ICs.
Die Bonding
Die bonding in semiconductor assembly ensures robustness, electrical connectivity, and effective heat removal, considering thermal, electrical, and mechanical factors.
Wafer Sawing
ALTER excels in wafer sawing, singulating wafers up to 12” for precise assembly in Plastic package and System-in-Package (SiP) applications.
Photonic Integrated Circuit (PIC) Packaging
ALTER excels in assembling and packaging Photonic Integrated Circuit (PIC) devices, including Silicon and InP PIC. Expert PIC packaging for optimal performance.
MEMS Packaging
ALTER excels in MEMS packaging, precision assembly of inertial sensors, accelerometers, microfluidic, and optical MEMS devices.
LED Chip-On-Board
LED Chip-on-Board benefits and advantages: cost-effectiveness, custom arrays, enhanced efficiency, and reduced ownership costs.
Image sensor packaging
Explore ALTER UK’s expertise in image sensor packaging assembly. Overcome unique challenges for correct function and device integrity.
Custom Photonic Packaging
Precision in Optoelectronic or Photonic Packaging ensures accurate alignment and coupling of light into and out of devices.
RF Module Packaging
ALTER UK offers customers support in both prototype/process development for RF Module Packaging as well as volume manufacturing capability.
SMT Soldering of QFN package: Application Note
This factsheet contains general guidelines for design of the PCB pads required to make reliable electrical and mechanical contacts to the individual terminals and exposed thermal pad of the QFN package range.
Fast Turn IC Packaging Design Rules
This ALTER’s factsheet introduces ASIC Prototype Packaging Design Rules and Non-standard wire/pad guidelines.